Place of Origin: | Guangdong, China (Mainland) |
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0.018mm * 520mm Single Side Shiny RA Cu Foil For FCCL With Japanese Technology
Description :
Applications:
Advantange :
it can supports the Anti-peeling of the solder oil when making HDI board by the mathod of chemical shen tin, chemical nickel gold and etc.
Mechanical Properties :
Item |
Unit |
Parameters |
|||||
12μm |
18μm |
25μm |
35μm |
70μm |
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Mass per unit(±5%) |
g/m² |
105 |
160 |
300 |
400 |
445 |
|
Cu+Ag |
% |
≥99.99 |
|||||
Temper |
|
H |
O,H |
O,H |
O,H |
O,H |
|
Surface roughness |
Ra |
μm |
0.13 |
0.12 |
0.1 |
0.08 |
0.08 |
Rz |
μm |
1.3 |
1.0 |
0.8 |
0.74 |
0.76 |
|
Tensile strength |
Normal Temp /23 |
N/mm² |
≥430 |
≥450 |
≥450 |
≥450 |
≥450 |
High Temp /220 |
N/mm² |
≥140 |
≥150 |
≥170 |
≥210 |
≥220 |
|
Elongation |
Normal Temp /23 |
% |
≥1.5 |
≥3.0 |
≥4.0 |
≥4.2 |
≥4.5 |
High Temp /220 |
% |
≥8 |
≥10 |
≥18 |
≥28 |
≥30 |
|
Fatigue Resistance (annealed) |
% |
65 |
65 |
65 |
65 |
65 |
|
Maximum resistivity |
Ωmm2/m |
0.0181 |
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Electrical conductivity |
% |
≥98.3% |
|||||
Film and adhesive layers |
Instant Temp. 300/10s |
Film and adhesive paste after transient temperature without blistering delamination. |
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Anti oxidation |
H.T.(200) |
Minute |
Won’t Change the Color within 60 minutes |
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Pinhole test results |
piece/ m² |
Pinhole area more than 0.5 mm²,0.005 piece/ m² |
Application Show :
Our Packing Condition :
Civen Metal Material Co.,Ltd [China (Mainland)]
Business Type:Manufacturer
City: Shanghai
Province/State: Shanghai
Country/Region: China (Mainland)