Place of Origin: | Guangdong, China (Mainland) |
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550mm-1295mm Width ED Copper Foil for Printed Circuit Board
Characteristics & Performance:
1. HTE, LP or VLP
2. Power Peeling Level: ≤II
3. Width Deviation: by roll~(+2.0,0) by sheets~(+2.0,-2.0)
4. Area Weight: fits the IPC-4562 3.3 protocol
5. Warranty: 180 days after delivery
6. Storage Conditions: neat and dry, no corruption chemical or wet things nearby.
Relative Humidity ≤ 65%, Temperature: ≤ 25°C
7. Packing: Wrapped by thin plastic film and loaded in wooden boxes, then fixed by packing belt.
A label with be pasted outside, showing product name, nw, gw, Rohs tag and manufacturer.
Technical Data:
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
Cu Content |
% |
≥99.8 |
||||
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
Tensile Strength |
R.T.(23) |
Kg/mm2 |
≥28 |
|||
H.T.(180) |
≥15 |
≥15 |
≥15 |
≥18 |
||
Elongation |
R.T.(23) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
H.T.(180) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
Matte(Rz) |
≤2.5 |
|||||
Peel Strength |
R.T.(23) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
Degraded rate of HCΦ(18%-1hr/25) |
% |
≤7.0 |
||||
Change of color(E-1.0hr/200) |
% |
Good |
||||
Solder Floating 290 |
Sec. |
≥20 |
||||
Appearance(Spot and copper powder) |
---- |
None |
||||
Pinhole |
EA |
Zero |
||||
Size Tolerance |
Width |
mm |
0~2mm |
|||
Length |
mm |
---- |
||||
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
Application
Civen Metal Material Co.,Ltd [China (Mainland)]
Business Type:Manufacturer
City: Shanghai
Province/State: Shanghai
Country/Region: China (Mainland)