51'' x 39'' Dimension Heavy Electrolytic Copper Foil Rolls / pcb copper foil
| Place of Origin: | Guangdong, China (Mainland) |
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Product Detail
51''x39'' Dimension Heavy ED Copper Foil for Printed Circuit Board
51''x39'' Dimension Heavy ED Copper Foil for Printed Circuit Board
Description :
CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).Ordinary thickness of the ED copper foils are 6 microns and 8 microns ,12 microns ,18 microns,35microns ,105 microns, 400 microns,etc. The maximum width of the ED copper foil iw 1370mm(53.93inch),.Also we can do special process according to customer requirements .
Technical Data:
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Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
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Cu Content |
% |
≥99.8 |
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Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
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Tensile Strength |
R.T.(25) |
Kg/mm2 |
≥28 |
≥30 |
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H.T.(180) |
≥15 |
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Elongation |
R.T.(25) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
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H.T.(180) |
≥4.0 |
≥5.0 |
≥6.0 |
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Roughness |
Shiny(Ra) |
μm |
≤0.4 |
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Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
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Peel Strength |
R.T.(23) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
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Degraded rate of HCΦ(18%-1hr/25) |
% |
≤5.0 |
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Change of color(E-1.0hr/190) |
% |
Good |
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Solder Floating 290 |
Sec. |
≥20 |
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Pinhole |
EA |
Zero |
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Preperg |
---- |
FR-4 |
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Metallographic:
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1/3OZ Rough Side (3000 times) |
Application
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Company Info
Civen Metal Material Co.,Ltd [China (Mainland)]
Business Type:Manufacturer
City: Shanghai
Province/State: Shanghai
Country/Region: China (Mainland)
